Hongteng Automation

The appraisal meeting was also attended by Hu Hongyan, Director of the Civil Explosives Management and Industry Safety Guidance Division of the Provincial Department of Economy and Information Technology, Zheng Weiguang, a Third-Level Researcher, and leaders of the Huzhou City and Changxing County industry authorities. Participating organizations included Xinlian Civil Explosives Group, Changpeng Company and Hongteng Company; General Manager Mr. Wu Qiong attended on behalf of Hongteng.

The appraisal committee comprised Liu Dabin, Professor at Nanjing University of Science and Technology; Jiang Rongguang, Professor at Nanjing University of Science and Technology; Jia Xiaohong, Researcher-level Senior Engineer at Xi'an Qinghua Civil Blasting Equipment Co., Ltd.; Wang Yuesheng, Professor at Hangzhou Dianzi University; Tang Sheng, Senior Engineer at Chongqing Shun'an Blasting Equipment Co., Ltd.; Gao Ming, Senior Engineer at Hongqi Chemical Co., Ltd. of Inner Mongolia Shengli Resources Group; Guan Yanyi, Researcher-level Senior Engineer at Shandong Shengshida Chemical Co., Ltd.; and other renowned civil-explosives industry experts.

The committee heard the project development summary and technical summary reports, verified the production-line equipment in operation on site, reviewed the relevant materials and sampled the performance of trial products. After questioning and discussion, the committee unanimously determined:The project is innovative, advanced, reliable and safe, its comprehensive technology has reached the internationally leading level, and it is agreed to pass the scientific and technological achievement appraisal.

The CPHTED-III electronic detonator automatic assembly line comprises three modules: wire processing, detonator assembly and automatic packaging. The wire-processing module automatically performs unwinding, slitting, winding, binding, stripping, fitting the junction-box lower cover, and visual inspection with defective-product removal. The detonator-assembly module performs automatic plug injection molding, leg-wire and chip riveting and welding, solder-joint inspection, base-detonator assembly and crimping, crimp inspection, electrical-parameter testing, chip 3-code binding, laser coding, junction-box cover assembly and junction-box coding (with provision for automatic glue injection and online terminal welding). The packaging module performs automatic unloading, bagging, bag sealing, case packing, instruction placement, labeling, weighing, label inspection and box sealing (with manual coding and packaging stations retained). The three modules are automatically linked to achieve continuous, unmanned, intelligent production.